发明名称 SYSTEMS AND METHODS FOR HAPTIC FEEDBACK FOR MODULAR DEVICES
摘要 PROBLEM TO BE SOLVED: To provide haptic feedback to modular computing devices through the use of mechanical vibrations.SOLUTION: A haptic output device 140 includes module holders 132b configured to couple the haptic output device to a computing device 101. The computing device includes an outer housing 120 configured to mechanically and electrically couple with one or more external electronic modules 134, 136. The haptic output device also includes a receiver configured to receive a haptic signal from a processor 128. The processor is configured to: receive a signal; determine a haptic effect based in part on the signal; generate the haptic signal based on the haptic effect; and transmit the haptic signal. The haptic output device is configured to output the haptic effect in response to receiving the haptic signal.SELECTED DRAWING: Figure 1
申请公布号 JP2016212886(A) 申请公布日期 2016.12.15
申请号 JP20160095716 申请日期 2016.05.12
申请人 IMMERSION CORP 发明人 VINCENT LEVESQUE
分类号 G06F3/041;G06F3/01 主分类号 G06F3/041
代理机构 代理人
主权项
地址
您可能感兴趣的专利