| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device which allows for high accuracy bonding work, by bringing a board into tight contact with a back-up plate, even if the chip mounting density is large.SOLUTION: A bonding device includes transportation means for transporting a board onto an adapter plate, suction means for sucking the board, transported onto the adapter plate by the transportation means, onto the adapter plate, heating means for heating the board via the adapter plate, and bonding a chip, to be disposed at the chip bonding part of the board, thereto, and a board presser means for pressing the board. The board presser means has a pair of press pieces for pressing the opposite sides of the board in parallel with the transportation direction thereof. By pressing the opposite side with the pair of press pieces, a pressing force is imparted in the direction for separating the opposite sides.SELECTED DRAWING: Figure 1 |
