发明名称 SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF SAME
摘要 A semiconductor device having an electrode with reduced electrical contact resistance even where either electrons or holes are majority carriers is disclosed. This device has an n-type diffusion layer and a p-type diffusion layer in a top surface of a semiconductor substrate. The device also has first and second metal wires patterned to overlie the n-type and p-type diffusion layers, respectively, with a dielectric layer interposed therebetween, a first contact electrode for electrical connection between the n-type diffusion layer and the first metal wire, and a second contact electrode for connection between the p-type diffusion layer and the second metal wire. The first contact electrode's portion in contact with the n-type diffusion layer and the second contact electrode's portion contacted with the p-type diffusion layer are each formed of a first conductor that contains a metal and a second conductor containing a rare earth metal.
申请公布号 US2008230804(A1) 申请公布日期 2008.09.25
申请号 US20080036703 申请日期 2008.02.25
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NISHI YOSHIFUMI;YAMAUCHI TAKASHI;TSUCHIYA YOSHINORI;KOGA JUNJI
分类号 H01L27/092;H01L21/283;H01L21/8238;H01L29/872 主分类号 H01L27/092
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