LEAD FRAME AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which has improved adhesiveness between a terminal part and a resin part, and the like.SOLUTION: A semiconductor device has: a lead frame 10 provided with a terminal part; a semiconductor chip 40 electrically connected to the terminal part; and a resin part 60 for sealing the semiconductor chip 40 so that a part of the terminal part is exposed. The terminal part has such a structure that a lower surface of an upper lead 32 is welded to an upper surface of a lower lead 22 so as to overlap the upper surface thereof. The lower surface of the upper lead 32 extends closer to a side of the semiconductor chip 40 than the upper surface of the lower lead 22 in a longitudinal direction of the terminal part. The lower surface of the upper lead 32 extends closer to both sides of the lower lead 22 than the upper surface thereof in a transverse direction of the terminal part. A region in which the lower surface of the upper lead 32 extends more than the upper surface of the lower lead 22 is covered with the resin part 60.SELECTED DRAWING: Figure 1