COPPER FOIL FOR FLEXIBLE PRINTED CIRCUIT BOARD, METHOD FOR PREPARING THE SAME, AND FLEXIBLE COPPER CLAD LAMINATE USING POLYAMIC ACID PRECURSOR AND COPPER FOIL

摘要

PURPOSE: A copper foil for a flexible printed circuit board and a manufacturing method thereof are provided to improve adhesion between the substrate and the copper film by forming a surface treatment film including silane compounds or their hydrolysate, and a flexible copper clad laminate using a polyamic acid precursor and a copper foil are provided. CONSTITUTION: A copper foil for a flexible printed circuit board includes an anticorrosive layer formed on a copper film and a surface treatment film formed on the anticorrosive layer. The surface treatment film comprises one or more compounds selected from the group consisting of silane compounds or their hydrolysate. A heat isolation layer is interposed between the copper foil and the anticorrosive layer.