INTEGRATED CIRCUIT PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide an integrated circuit package that has a reduced package area and minimizes electrical interference between multiple integrated circuit chips.

SOLUTION: An integrated circuit package comprises: a substrate 310; a device portion 320 formed on a surface of the substrate; a first integrated circuit chip 330 which is formed over the device portion 320 and is electrically connected to the substrate through bonding wires; and a second integrated circuit chip 340 that is formed in an area on the surface of the substrate so as to overlap the first integrated circuit chip in a plane view.

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