| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of enhancing a bonding strength between a light-emitting device and a land.SOLUTION: A semiconductor device comprises: a mounting substrate that includes a land having a first surface and a second surface higher than the first surface; a light-emitting device that includes an external connection terminal disposed on the first surface; and a bonding member disposed on at least the second surface and that bonds the external connection terminal and the land with each other.SELECTED DRAWING: Figure 3 |
