| 发明名称 |
WAFER POLISHING APPARATUS |
| 摘要 |
An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool. |
| 申请公布号 |
US2016297048(A1) |
申请公布日期 |
2016.10.13 |
| 申请号 |
US201615188638 |
申请日期 |
2016.06.21 |
| 申请人 |
EBARA CORPORATION |
发明人 |
TOGAWA Tetsuji;YOSHIDA Atsushi;WATANABE Toshifumi |
| 分类号 |
B24B9/06;H01L21/463;H01L21/02;B24B21/00 |
主分类号 |
B24B9/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate polishing apparatus, comprising:
a substrate holder configured to rotate the substrate; a first polishing tool configured to press against an edge portion of the substrate to polish the edge portion; and a second polishing tool configured to press against the edge portion of the substrate to polish the edge portion, the second polishing tool being located more inwardly than the first polishing tool with respect to a radial direction of the substrate, the first polishing tool having a polishing surface more abrasive than a polishing surface of the second polishing tool. |
| 地址 |
Tokyo JP |
