| 摘要 |
A method for fabricating a thermally enhanced semiconductor package including the steps of providing a substrate having a first surface and a second surface; providing a die on the first surface of the substrate and electrically connecting the die with the substrate; placing the die, the substrate, and a heat slug in a mold cavity defined by a mold cast, the mold cast having a protruding portion that touches the periphery on the surface of the heat slug, wherein the contact area is defined as a periphery region and the non-contact area enclosed by the periphery region is defined as a central region; and encapsulating the die and the heat slug by molding materials, wherein the periphery region and the central region of the heat slug are exposed to the ambient air. |
