| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-conductive silicone composition capable of being coated using an efficient method for mass production, such as dispense coating or screen printing, exhibiting good heat-conductivity, having strong adhesion to a heat-generating electronic component and a heat-dissipating component, and causing no oil separation and pump-out phenomenon, so that having excellent workability, heat-dissipating performance and reliability. Ž<P>SOLUTION: The heat-conductive silicone composition comprises a composition containing (A) a silicone resin, (B) a heat-conductive filler, and (C) a volatile solvent in which the silicone resin and the heat-conductive filler can be dissolved or dispersed. It is a heat-dissipating material disposed between the heat-generating electronic component which generates heat while in operation and raises its temperature to the level higher than room temperature and the heat-dissipating component. It is a flowable greasy composition at room temperature prior to application to the heat-generating electronic component or the heat-dissipating component. After the application, it becomes a non-flowable, heat-softening and heat-conductive composition as the volatile solvent in the composition volatilizes off, and it reduces its viscosity, softens or melts due to the heat generated during the operation of the electronic component, so that at least the surface is fluidized. Thus, a gap between the electronic component and the heat-dissipating component is filled up with the heat-conductive silicone composition, substantially without any void. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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