| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a case-shaped power semiconductor device which is excellent in productivity and recyclability with a case easy to reuse. <P>SOLUTION: The power semiconductor device has a resin package including a power semiconductor element and a control semiconductor element mounted on a principal plane of a lead frame, and sealed with mold resin; a power terminal led from the resin package and electrically connected with the power semiconductor element; a control terminal led from the resin package and electrically connected with the control semiconductor element; and a cylindrical case separably structured from the resin package for surrounding the resin package. The power terminal and the control terminal are respectively led out from lead insertion ports provided on the case, and part of the power terminal led from the case is bent along an end surface of the case. <P>COPYRIGHT: (C)2008,JPO&INPIT |
