| 摘要 |
PROBLEM TO BE SOLVED: To provide a process sheet for manufacturing a semiconductor device capable of obtaining a semiconductor device with less adhesion of burrs by suppressing resin leakage when a semiconductor chip is encapsulated with a resin, and of removing adhered burrs with ease.SOLUTION: A process sheet 1 for manufacturing a semiconductor device comprises: a base material 3; and an uneven layer 5 contacted with a substrate mounting a semiconductor chip when the semiconductor chip is encapsulated. The uneven layer 5 contains particles 9. An average primary particle diameter R (μm) of the particles 9, a maximum value Tmax (μm) of a thickness of the uneven layer 5, and a minimum value Tmin (μm) of the thickness of the uneven layer 5 satisfy the following formula (1): (Tmin+Tmax)/2×0.5<R<(Tmin+Tmax)/2×1.3 (1).SELECTED DRAWING: Figure 1 |
