| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink cooling device having improved cooling performance. SOLUTION: In the heat sink cooling device 5 in which heat-generating objects 3 are arranged on a heat sink 2 provided with a plurality of pin fins 11, other straight fins (louver) 6 are arranged toward the heat-generating objects 3 roughly perpendicular to a height direction of the pin fins 11 in an upstream of one end 11b of the pin fins 11. By this configuration, air from an air inlet 5a flows to between the louvers 6, and flows into the pin fins 11 obliquely toward the heat-generating objects 3, while generating vortex on the downstream side of the pin fins 11, and collides with a fin base portion 11c near the heat-generating objects 3. Thereby, a boundary layer becomes thin, and a heat transfer coefficient increases. Consequently, the cooling performance can be improved. COPYRIGHT: (C)2007,JPO&INPIT
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