| 摘要 |
In the present invention, when viewed in a direction in which a main surface 1Na of a semiconductor substrate 1N and a main surface 1Nb thereof oppose each other, the semiconductor substrate has a pair of opposing first edges 1N1, a pair of opposing second edges 1N2 and a third edge 1N3 that is connected to one end of one of the first edges 1N1 and one end of one of the second edges 1N2. An electrode E3 is disposed on the semiconductor substrate 1N and is electrically connected to a plurality of pixels (avalanche photodiodes APD). An electrode E5 is disposed on a mounting substrate 20. A bonding wire W1 has one end that is connected to the electrode E3 and one end that is connected to the electrode E5. The bonding wire W1 is disposed so as to cross the third edge 1N3 when viewed in the direction in which the main surface 1Na and the main surface 1Nb oppose each other. |
