Semiconductor packages with interposers and methods of manufacturing the same

摘要

A semiconductor package may include a first semiconductor chip, a second semiconductor chip disposed to overlap with a portion of the first semiconductor chip and connected to the first semiconductor chip through first coupling structures. The semiconductor package may include an interposer disposed to overlap with another portion of the first semiconductor chip and may be connected to the first semiconductor chip through second coupling structures. A first surface of the interposer may face the first semiconductor chip, and the interposer may include second internal interconnectors extending from the second coupling structures on the first surface to a second surface of the interposer opposite to the first face. External interconnectors may be disposed on the second surface of the interposer and are connected to the second internal interconnectors.

主权项

1. A semiconductor package comprising:
a first semiconductor chip; a second semiconductor chip disposed to overlap with a portion of the first semiconductor chip and connected to the first semiconductor chip through first coupling structures; an interposer disposed to overlap with another portion of the first semiconductor chip and connected to the first semiconductor chip through second coupling structures, wherein a first surface of the interposer faces the first semiconductor chip and the interposer includes internal interconnectors extending from the second coupling structures on the first surface to a second surface of the interposer opposite to the first surface; and external interconnectors disposed on the second surface of the interposer and connected to the internal interconnectors wherein at least one of the external interconnectors extends onto a first surface of the second semiconductor chip opposite to a second surface of the second semiconductor chip facing the first semiconductor chip.