| 发明名称 |
METHOD FOR ANCHORING A CONDUCTIVE CAP ON A FILLED VIA IN A PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD WITH AN ANCHORED CONDUCTIVE CAP |
| 摘要 |
The present invention relates to forming an anchored cap in a filled via in a PCB. The cap is formed by making an anchor opening in the filled via, depositing copper into the anchor opening to form an anchor portion, and subsequently depositing a cap portion over the filled via and the anchor portion, so that the anchored cap is anchored to the filled via by the anchor portion. In another embodiment, the anchor portion and cap portion may be deposited in one step. |
| 申请公布号 |
US2016316563(A1) |
申请公布日期 |
2016.10.27 |
| 申请号 |
US201514694756 |
申请日期 |
2015.04.23 |
| 申请人 |
Viasystems Technologies Corp., L.L.C. |
发明人 |
Sidhu Rajwant;Zepeda Ruben |
| 分类号 |
H05K1/11;H05K3/06;H05K3/00;H05K3/04;H05K3/42 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for forming an anchored cap on a filled via in a printed circuit board (PCB), the method comprising:
removing via fill material from the filled via to form an anchor opening; metalizing the anchor opening; forming an anchor portion in the filled via; and forming a conductive cap portion over the anchor portion to form an anchored cap. |
| 地址 |
St. Louis MO US |
