| 摘要 |
When removing substrates bonded by a thermocompression apparatus from a substrate holder, separation is difficult because portions of the substrate and substrate holder become stuck to each other due to melting or intake of dust that is unavoidably present between the substrate and the substrate holder. Therefore, a mechanism is desired that can appropriately separate the substrate from the substrate holder even when portions of the substrate and the substrate holder are stuck to each other. Provided is a substrate holder pair comprising a first substrate holder that holds one of two substrates to be bonded to each other; and a second substrate holder that holds the other substrate, such that the two bonded substrates are between the first substrate holder and the second substrate holder. The first substrate holder includes a pressure receiving portion that, when the first substrate holder is separated from the second substrate holder, receives a force in a direction of separation from the second substrate holder. |
