| 摘要 |
An adhesive which has a high degree of moist-heat resistance that enables the adhesive layer to withstand soldering with a lead-free solder under high-humidity conditions and which has excellent adhesiveness under high-temperature high-humidity conditions, while retaining adhesion to various plastic films, metals, and glass-epoxies. A B-stage adhesive sheet obtained from the adhesive is provided which has a satisfactory sheet life and can retain satisfactory adhesive properties even when used after having been transported under high-temperature high-humidity conditions. The resin composition for adhesives comprises a thermoplastic resin (A), an inorganic filler (B), a solvent (C), and an epoxy resin (D), wherein the thermoplastic resin (A) has an acid value and a number-average molecular weight which are in specific ranges, the epoxy resin (D) is an epoxy resin having a dicyclopentadiene skeleton, and a dispersion (a) having a specific makeup including the thermoplastic resin (A) and the inorganic filler (B) in a total amount of 25 parts by mass and in the same proportion as in the resin composition for adhesives has a thixotropic index (TI value) of 3-6 at 25ºC. |
