| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a layered structure, in which a via hole can be formed well and smear can hardly remain at the bottom of the via hole.SOLUTION: The method for producing the layered structure comprises the steps of: using a laminated film, which includes a filler-containing insulation film and a protective film layered on the first surface of the insulation film, laminating the insulation film on a lamination target member, which has a metal layer on the surface thereof, from the side of the second surface opposite to the first surface; preliminarily curing the insulation film; irradiating the preliminarily-cured insulation film with a laser beam to form the via hole, which penetrates the protective film and the insulation film; peeling the protective film; and removing the smear on the inside of the via hole by desmear treatment. The protective film in the laminated film has 70% or lower light transmittance when irradiated with the laser beam. The light absorption coefficient εper unit weight of the components (excluding a filler) of the insulation film in the laminated film is 0.03 or higher.SELECTED DRAWING: Figure 1 |
