发明名称 SUBSTRATE PROCESSING APPARATUS AND METHOD FOR DETECTING ABNORMALITY OF SUBSTRATE
摘要 A substrate processing apparatus having a detecting unit that can detect an abnormality of a substrate such as a crack of the substrate or chipping of the substrate is disclosed. The substrate processing apparatus includes a polishing unit configured to polish a substrate, a cleaning unit configured to clean the polished substrate, a substrate abnormality detection unit configured to detect an abnormality of the substrate, and a substrate transporting mechanism configured to transport the substrate in the order of the polishing unit, the substrate abnormality detection unit, and the cleaning unit. The substrate abnormality detection unit includes an imaging device configured to image the substrate, and an output monitoring unit configured to determine a status of the substrate by comparing a signal obtained from the imaging device with a predetermined threshold.
申请公布号 US2016315002(A1) 申请公布日期 2016.10.27
申请号 US201615132928 申请日期 2016.04.19
申请人 EBARA CORPORATION 发明人 KOMATSU Mitsunori;MARUYAMA Toru;ISONO Yoshinori;YANAGI Hiroaki
分类号 H01L21/67;B24B37/005;B24B37/34;H01L21/66;H01L21/687 主分类号 H01L21/67
代理机构 代理人
主权项 1. A substrate processing apparatus comprising: a polishing unit configured to polish a substrate; a cleaning unit configured to clean the polished substrate; a substrate abnormality detection unit configured to detect an abnormality of the substrate; and a substrate transporting mechanism configured to transport the substrate in the order of the polishing unit, the substrate abnormality detection unit, and the cleaning unit; the substrate abnormality detection unit comprising: an imaging device configured to image the substrate; andan output monitoring unit configured to determine a status of the substrate by comparing a signal obtained from the imaging device with a predetermined threshold.
地址 Tokyo JP