RESIN COMPACT, METHOD FOR PRODUCING RESIN COMPACT, RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

摘要

THE PRESENT INVENTION IS RELATED TO A METHOD FOR PRODUCING A RESIN COMPACT CONTAINING AN EPOXY RESIN, A CURING AGENT, A CURING ACCELERATOR AND AN INORGANIC FILLER. THE METHOD INCLUDES A KNEADING AND CRUSHING PROCESS FOR PREPARING A FIRST POWDER MATERIAL OBTAINED BY MIXING, HEAT-MELTING, KNEADING AND CRUSHING A FIRST COMPONENT CONTAINING THE EPOXY RESIN AND THE CURING AGENT AND THE INORGANIC FILLER, BUT NOT CONTAINING THE CURING ACCELERATOR; A PULVERIZING PROCESS FOR PREPARING A SECOND POWDER MATERIAL OBTAINED BY PULVERIZING A SECOND COMPONENT CONTAINING THE CURING ACCELERATOR; A MIXING PROCESS FOR PREPARING A RESIN COMPOSITION BY DISPERSING AND MIXING THE FIRST POWDER MATERIAL AND THE SECOND POWDER MATERIAL; AND A MOLDING PROCESS FOR OBTAINING THE RESIN COMPACT BY COMPRESSION-MOLDING THE RESIN COMPOSITION. THIS MAKES IT POSSIBLE TO OBTAIN A RESIN COMPACT (PARTICULARLY, A RESIN COMPACT FOR ENCAPSULATION) HAVING SUPERIOR LONG TERM STORAGE STABILITY AT ROOM TEMPERATURE, GOOD CURABLE PROPERTY AND FLUIDITY. (FIGURE 1)