Electronic circuit assembly, device comprising such assembly and method for fabricating such device

摘要

An electronic circuit assembly (A1) comprises a casing (1) having two opposite outer faces (S1 sup , S1 inf ) and an inner space (V1) separate from each of said outer faces by a respective closing portion (4, 5), and a die (10) incorporating an integrated circuit. The casing (1) includes integrated electrically conducting elements (21) connecting terminals of the die (11) to pads of the casing (31 sup ). The electrically conducting elements also connect sets of pads respectively located on each one of the opposite outer faces of the casing (31 sup , 31 inf )· Such electronic circuit assemblies (A1-A4) are suitable for being stacked with bonding means (300, 303) arranged between respective sets of pads (31 sup , 32 inf ) of two successive electronic circuit assemblies in a stack.