METALLISIERUNGSMASSE UND VERFAHREN ZUM METALLISIEREN EINER VERTIEFUNG IN HALBLEITERPACKUNGEN SOWIE DAS DABEI ERHALTENE PRODUKT

摘要

A process and composition are provided for the gold metallization of the bottoms of cavities in semiconductor packages wherein the walls of such cavities are left free from gold which might otherwise create short circuits between the face of the package and the bottom of the cavity. Semiconductor packages provided by the use of this process are different from and preferred over packages produced by their prior methods.