| 摘要 |
1367436 Semi-conductor device mounting STANDARD TELEPHONES & CABLES Ltd 17 May 1973 23526/73 Heading H1K A substrate with flexible leads is made by attaching to a substrate body side by side lengths of wire each with an intermediate portion partially wrapped round and bonded to the body and ends extending from it, and removing part of each intermediate portion and of the underlying body material to provide a surface constituting a mounting location for a solid state device disposed between two sets of terminal areas, constituted by the newly formed ends of the wires lying flush with the surface. For example, enamelled copper wire is wound around a semi-cylindrical mandrel, e.g. of copper or plastics and a parallel auxiliary mandrel, the wire bonded to the mandrel surface with epoxy resin, the wire cut adjacent the auxiliary mandrel and the main mandrel machined to provide a flat surface in which the wire ends are exposed. In alternative forms the mandrel initially has flanged ends which are retained after machining and a rectangular aperture extending between them, or comprises a central portion, bounded by through slots inclined to each other but extending from one end parallel to its axis, and around which the wire is wound. Accurate spacing of the turns may be ensured by grooving the surface of the mandrel. The device, e.g. a light emitting diode or diode array is mounted on the machined surface and its bonding pads connected by flying leads to the flanking terminal areas. Where the mandrel is apertured the device is located on an inverted T section auxiliary substrate and is tested before being located in the aperture for connection (Fig. 8). |
