发明名称 THERMOSENSITIVE RESIN, THERMOSENSITIVE ADHESIVE AND THERMOSENSITIVE ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermosensitive resin having excellent heat resistance and chemical resistance, and a thermosensitive adhesive and a thermosensitive adhesive composition that contain the resin.SOLUTION: The invention provides a thermosensitive resin represented by the general formula (I) in the figure. The invention also provides a thermosensitive adhesive and a thermosensitive adhesive composition that contain the thermosensitive resin. [In the formula, multiple Rrepresent identical or different C1-10 monovalent hydrocarbon groups or hydrogen atoms; Rrepresents a hydrogen atom; Rrepresents a C12-50 linear alkyl group; and a, b and c are as described in the specification.]SELECTED DRAWING: None
申请公布号 JP2016186013(A) 申请公布日期 2016.10.27
申请号 JP20150066413 申请日期 2015.03.27
申请人 NITTA IND CORP;NAGASAKI UNIV 发明人 YAMAGUCHI SATOSHI;KAWAHARA SHINICHIRO;MURAKAMI HIROTO;HASUO RYOSUKE
分类号 C08G77/12;C08G77/38;C09J7/00;C09J11/02;C09J183/04 主分类号 C08G77/12
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