发明名称 |
THERMOSENSITIVE RESIN, THERMOSENSITIVE ADHESIVE AND THERMOSENSITIVE ADHESIVE COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermosensitive resin having excellent heat resistance and chemical resistance, and a thermosensitive adhesive and a thermosensitive adhesive composition that contain the resin.SOLUTION: The invention provides a thermosensitive resin represented by the general formula (I) in the figure. The invention also provides a thermosensitive adhesive and a thermosensitive adhesive composition that contain the thermosensitive resin. [In the formula, multiple Rrepresent identical or different C1-10 monovalent hydrocarbon groups or hydrogen atoms; Rrepresents a hydrogen atom; Rrepresents a C12-50 linear alkyl group; and a, b and c are as described in the specification.]SELECTED DRAWING: None |
申请公布号 |
JP2016186013(A) |
申请公布日期 |
2016.10.27 |
申请号 |
JP20150066413 |
申请日期 |
2015.03.27 |
申请人 |
NITTA IND CORP;NAGASAKI UNIV |
发明人 |
YAMAGUCHI SATOSHI;KAWAHARA SHINICHIRO;MURAKAMI HIROTO;HASUO RYOSUKE |
分类号 |
C08G77/12;C08G77/38;C09J7/00;C09J11/02;C09J183/04 |
主分类号 |
C08G77/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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