| 摘要 |
A method of and apparatus for exposing boards which are photosensitive on both sides, for production of printed circuits on both sides, to light through films on both sides in which a lower film, a board, and an upper film in registered position on a light-transmitting platen are pressed down by a window and exposed to light on both sides through the platen and window, the window, gripping the upper film, is raised, the exposed board is removed, another board to be exposed is applied to the lower film on the platen, the window is lowered to apply the upper film to the new board, and the procedure repeated.
|
