| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has excellent electric characteristics even when a plurality of stacked semiconductor chips are embedded in a mold material containing a filler. <P>SOLUTION: The semiconductor device includes a support substrate 1, a semiconductor chip 3 disposed on the support substrate, an adhesive layer 4 formed on the semiconductor chip, a silicon chip arranged on the adhesive layer, a terminal portion 10, a bonding wire 9 electrically connecting the semiconductor chip and terminal portion to each other, and a mold 11 covering the semiconductor chip, silicon chip, and terminal portion and a bonding wire and containing the filler, wherein the area of a part of the adhesive layer which comes into contact with the semiconductor chip is larger than the area of a part which comes into contact with the silicon chip. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
