发明名称 |
Metal gate structure |
摘要 |
A device comprises a metal gate structure in a trench and over a substrate, wherein the gate structure comprises a first metal sidewall in the trench, wherein the first metal sidewall becomes progressively thinner towards an upper portion of the first metal sidewall, a second metal sidewall in the trench, wherein the second metal sidewall becomes progressively thinner towards an upper portion of the second metal sidewall and a metal bottom layer on a bottom of the trench and between the first metal sidewall and the second metal sidewall. |
申请公布号 |
US9478623(B2) |
申请公布日期 |
2016.10.25 |
申请号 |
US201414497114 |
申请日期 |
2014.09.25 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Lim Peng-Soon;Ho Tsai-Jung |
分类号 |
H01L29/49;H01L29/423;H01L21/28;H01L21/8234;H01L29/51 |
主分类号 |
H01L29/49 |
代理机构 |
Slater Matsil, LLP |
代理人 |
Slater Matsil, LLP |
主权项 |
1. A structure comprising:
a metal layer partially filling a trench of a metal gate structure, wherein the metal layer comprises:
a first metal sidewall;a second metal sidewall; anda metal bottom layer between the first metal sidewall and the second metal sidewall, wherein:
an upper portion of the first metal sidewall is thinner than a lower portion of the first metal sidewall, wherein the upper portion and the lower portion of the first metal sidewall form a first slope region, and wherein the first slope region has a vertical sidewall and a non-vertical sidewall; andan upper portion of the second metal sidewall is thinner than a lower portion of the second metal sidewall, wherein the upper portion and the lower portion of the second metal sidewall form a second slope region, and wherein the second slope region has a vertical sidewall and a non-vertical sidewall. |
地址 |
Hsin-Chu TW |