发明名称 Metal gate structure
摘要 A device comprises a metal gate structure in a trench and over a substrate, wherein the gate structure comprises a first metal sidewall in the trench, wherein the first metal sidewall becomes progressively thinner towards an upper portion of the first metal sidewall, a second metal sidewall in the trench, wherein the second metal sidewall becomes progressively thinner towards an upper portion of the second metal sidewall and a metal bottom layer on a bottom of the trench and between the first metal sidewall and the second metal sidewall.
申请公布号 US9478623(B2) 申请公布日期 2016.10.25
申请号 US201414497114 申请日期 2014.09.25
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Lim Peng-Soon;Ho Tsai-Jung
分类号 H01L29/49;H01L29/423;H01L21/28;H01L21/8234;H01L29/51 主分类号 H01L29/49
代理机构 Slater Matsil, LLP 代理人 Slater Matsil, LLP
主权项 1. A structure comprising: a metal layer partially filling a trench of a metal gate structure, wherein the metal layer comprises: a first metal sidewall;a second metal sidewall; anda metal bottom layer between the first metal sidewall and the second metal sidewall, wherein: an upper portion of the first metal sidewall is thinner than a lower portion of the first metal sidewall, wherein the upper portion and the lower portion of the first metal sidewall form a first slope region, and wherein the first slope region has a vertical sidewall and a non-vertical sidewall; andan upper portion of the second metal sidewall is thinner than a lower portion of the second metal sidewall, wherein the upper portion and the lower portion of the second metal sidewall form a second slope region, and wherein the second slope region has a vertical sidewall and a non-vertical sidewall.
地址 Hsin-Chu TW