| 摘要 |
A device for spacing overhead, parallel subconductors of a conductor bundle and for damping vibrations of the subconductors. The device comprises rigid, elongated arms pivotally connected to each other by a rigid means at one end of each arm, with the other end of each arm being radially spaced from the rigid means and provided with a clamp for attaching the arm to a subconductor. Resilient damping devices, such as close coil springs, are secured in the arms at a location adjacent the rigid means pivotally connecting the arms to each other.
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