发明名称 MULTILAYER STRUCTURE FOR CAPACITIVE PRESSURE SENSING
摘要 A multilayer structure for a garment, optionally footwear, includes a flexible substrate film for accommodating electronics, a number of flexible sensor pads provided on the film utilizing printed electronics technology, optionally screen printing or ink jetting, at least one electronic circuit, preferably integrated circuit, further provided on the film for controlling capacitive measurements via the number of sensor pads for obtaining an indication of pressure subjected to the multilayer structure, a number of conductor traces further printed on the film for electrically connecting the at least one electronic circuit and the number of capacitive sensor pads, a power supply element for powering electricity-driven components including the at least one electronic circuit, and at least one plastic layer molded upon the film substantially embedding the number of sensor pads, conductor traces and the at least one electronic circuit therewithin. A related method of manufacture is presented.
申请公布号 US2016290878(A1) 申请公布日期 2016.10.06
申请号 US201514677075 申请日期 2015.04.02
申请人 Tacto Tek Oy 发明人 SEVERINKANGAS Kari;HEIKKINEN Mikko;SAASKI Jarmo
分类号 G01L1/14;H05K3/10 主分类号 G01L1/14
代理机构 代理人
主权项 1. A multilayer structure for a garment, comprising a flexible substrate film for accommodating electronics, a number of flexible sensor pads provided on the film utilizing printed electronics technology, optionally screen printing or ink jetting, at least one electronic circuit, preferably integrated circuit, further provided on the film for controlling capacitive measurements via the number of sensor pads for obtaining an indication of pressure subjected to the multilayer structure, a number of conductor traces further printed on the film for electrically connecting the at least one electronic circuit and the number of capacitive sensor pads, a power supply element for powering electricity-driven components including the at least one electronic circuit, and at least one plastic layer molded upon the film substantially embedding the number of sensor pads, conductor traces and the at least one electronic circuit therewithin.
地址 Kempele FI