发明名称 Method for making a raw board for use in printed circuits
摘要 A method for preparing a raw board for use in printed circuits comprising the steps of first electroplating a foil or sheet of synthesized resins in an electrolytic bath containing copper sulfate, sulfuric acid, chlorine ion and a surface glazing agent including thiourea, and secondly electroplating the foil or sheet completed the above step in a conventional electrolytic bath containing copper sulfate and sulfuric acid. Also, an apparatus therefor is disclosed.
申请公布号 US4231848(A) 申请公布日期 1980.11.04
申请号 US19790035695 申请日期 1979.05.03
申请人 NIPPON MINING CO., LTD. 发明人 KAWASUMI, YOSHIO;SATO, HARUKI
分类号 H05K3/18;C23C18/16;C23C18/31;C23C18/40;C25D5/10;C25D5/56;H05K1/00;H05K3/02;H05K3/24;H05K3/34;H05K3/38;(IPC1-7):C25D5/10 主分类号 H05K3/18
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