发明名称 |
Method for making a raw board for use in printed circuits |
摘要 |
A method for preparing a raw board for use in printed circuits comprising the steps of first electroplating a foil or sheet of synthesized resins in an electrolytic bath containing copper sulfate, sulfuric acid, chlorine ion and a surface glazing agent including thiourea, and secondly electroplating the foil or sheet completed the above step in a conventional electrolytic bath containing copper sulfate and sulfuric acid. Also, an apparatus therefor is disclosed.
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申请公布号 |
US4231848(A) |
申请公布日期 |
1980.11.04 |
申请号 |
US19790035695 |
申请日期 |
1979.05.03 |
申请人 |
NIPPON MINING CO., LTD. |
发明人 |
KAWASUMI, YOSHIO;SATO, HARUKI |
分类号 |
H05K3/18;C23C18/16;C23C18/31;C23C18/40;C25D5/10;C25D5/56;H05K1/00;H05K3/02;H05K3/24;H05K3/34;H05K3/38;(IPC1-7):C25D5/10 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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