| 摘要 |
Hot melt adhesive compositions comprising a block copolymer, aluminum powder, glass fiber and hollow inorganic silicate microspheres. The block copolymer is selected from the group consisting of copolyesters, copolyamides, copoly(esteramides) and copoly(ether-esters) melting at a temperature above about 150 DEG C. and having from about 30 to about 70 weight percent of hard segments and from about 70 to about 30 weight percent of soft segments. The weight ratio of block copolymer to aluminum powder, glass fiber and silicate microspheres is in the range of about 3:7 to about 3:2, the weight ratio of block copolymer to glass fiber is at least about 2:1, the weight ratio of glass fiber to aluminum powder is at least about 1:9 and wherein the volume percent of silicate microspheres is less than about 10. The compositions are particularly useful for filling voids and cavities in substrates.
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