Electronic components assembly apparatus and method for making

摘要

An apparatus for making electronic component assembly comprising: a first tape feeder for feeding a supporting tape to an assembly stage, a punching tool for making perforations with a predetermined pitch on said supporting tape, a feeding way for feeding electronic components near said assembly stage at then consecutively pushes said electronic component onto said supporting tape in said assembly stage, a rotating drum having around its outer face a number of projections to engage to said perforations and a number of guiding member to define positions of lead-wires of said electronic components when pushed onto said supporting tape, a second tape feeder for feeding a bonding tape onto said supporting tape at a position after said assembly stage in a manner not to cover said perforations and a bonding roller for pressing to bond said bonding tape onto said supporting roller with said lead-wires inbetween.