发明名称 HIGH-SPEED SPUTTERING DEVICE FOR FERROMAGNETIC MATERIAL
摘要 PURPOSE:To sputter a ferromagnetic material at a high speed and to prevent the sputtering of a backing plate, by constituting a ferromagnetic material target of plural pieces of ferromagnetic materials disposed apart from each other at the small spacings intersected with the thickness direction thereof. CONSTITUTION:Ferromagnetic material 1a is formed so as to intersect with the thickness direction of a ferromagnetic material target 1 by inclining or curving the small spacings 5 equivalent to said material. The ion of gaseous Ar or the other gas fed into a vacuum treating chamber 17 enters the spacings 5 and collides with the inside wall thereof, thereby sputtering the material 1a. The sputtering of a backing plate 2 of a nonmagnetic material provided on the rear of the target 1 is prevented in this stage. Since the magnetic field of a magnetic field generator 3 further behind the plate 2 generates a relatively large leakage magnetic field on the surface of the target 1, the ferromagnetic material is deposited on the surface of a substrate 18 at a high speed.
申请公布号 JPS58177468(A) 申请公布日期 1983.10.18
申请号 JP19820058150 申请日期 1982.04.09
申请人 NIPPON SHINKU GIJUTSU KK 发明人 ITOU AKIO;NAKAMURA KIYUUZOU;OOTA YOSHIFUMI;YAMADA TAIKI
分类号 C23C14/36;C23C14/35;H01J37/34 主分类号 C23C14/36
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