摘要 |
PURPOSE:To enable to perform the fixing of a semiconductor photo detector on a substrate securely and easily, by providing metals for fixing on the semiconductor photo detector. CONSTITUTION:Metallized parts 13a are formed at both end parts of an insulation substrate 5 which constitutes the semiconductor photo detector, and the surfaces thereof are plated with Ag, etc. This metallized part 13a serves as the mount part to the substrate 9. In other words, when a plurality of the detectors are mounted on the substrate 9, each detector is arranged between printing wiring patterns 10 formed on the substrate 9. Next, the metallized part 13a and the wiring pattern 10 are fixed each other by means of solder 11. Such a constitution enables to perform the fixing of the semiconductor photo detectors on the substrate easily and securely. Mechanical loads can be prevented from being applied to the signal take-out pins 8 of the detector. |