ASSEMBLY AND PACKAGING OF INTEGRATED CIRCUIT CHIPS,申请号IE19850000734-传众专利搜索

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发明名称	ASSEMBLY AND PACKAGING OF INTEGRATED CIRCUIT CHIPS
摘要
申请公布号	IE850734(L)	申请公布日期	1985.09.22
申请号	IE19850000734	申请日期	1985.03.22
申请人	MOSTEK CORP	发明人
分类号	H01L21/68;(IPC1-7):H01L21/68	主分类号	H01L21/68
代理机构		代理人
主权项
地址

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