| 摘要 |
PURPOSE:To spot-plate accurately a long-sized lead frame when the frame is moved and spot-plated with a plating soln. spouted from holes in a sparge mask, by using a specified device for positioning a lead frame. CONSTITUTION:A long-sized lead frame 1 for IC is brought into contact with a sparge mask 3 having holes for spouting a plating soln., and the frame 1 is intermittently moved. While the frame 1 is not moved, a plating soln. is spouted from the holes in the mask 3 to spot-plate the frame 1. At this time, the frame 1 is roughly positioned by inserting pins 5 into holes 8 for positioning in the frame 1 with the cylinder 6 of a positioning device 7 which can be moved independently of the mask 3. The device 7 itself is then moved vertically and laterally by very small extents to position accurately the frame 1 with respect to the mask 3, and the frame 1 is accurately spot-plated by spouting the plating soln. from the holes in the mask 3.
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