发明名称 DIE BONDING METHOD
摘要 PURPOSE:To contrive improvement in efficiency of operation as well as to facilitate an adjusting work by a method wherein the scrubbing in X-Y direction on the side of a die-collet and the swinging operation on the side of a substrate are performed for almost same period of time. CONSTITUTION:A die-collet 5 is fixed to a Z-sliding plate 44 through the intermediaries of a collet holder 4 and an arm 1. The sliding plate 44 performs a vertical movement on a substrate 39. The Z-substrate 39 is placed on the Y- substrate 29, the Y-substrate 29 is placed on an X-substrate 33, and the X- substrate 33 and the Y-substrate 20 perform a vertical movement. On a swinging part, a heater block is fixed on a swinging block substrate 11 using two poles 10, and the entire swinging part functions with rotational centers 8 and 8' as the center point. A die-collect 46, an IC chip 47, Au 50 and a substrate 6 perform a relative movement together with a heater block 49 as shown by the arrows A-C in the diagram. As a scrubbing process is performed in X-Y direction while a swinging operation is being conducted, the recesses and the protrusions and the inclination of the substrate are absorbed, and the effect of correction by swinging can be obtained even parallelism is out of order a little.
申请公布号 JPS61131537(A) 申请公布日期 1986.06.19
申请号 JP19840253509 申请日期 1984.11.30
申请人 NEC CORP 发明人 FUKUI YOSHIAKI
分类号 H01L21/52;H01L21/58;(IPC1-7):H01L21/58 主分类号 H01L21/52
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