| 摘要 |
PURPOSE:To feed the prescribed quantity of adhesive liquid to adhering position with good accuracy by inclining for the vertical direction of the adhering position face a dispenser head in case of adhering an adhesive liquid automatically by said dispenser. CONSTITUTION:In case of adhering a solder cream to the fitting position of the coil of a circuit board 1 and lead connection position, the solder cream is adhered by inclining 5-40 deg., 15 deg. for instance, a dispenser 4 for the vertical direction 3 of a fitting face 2. For this purpose the dispenser 4 is fixed with holding to the fixing jig 5 of L shaped section to be engaged with the cylinder 6 supported by tables X.Y. The dispenser 4 is moved to the mounting position programmed by the tables X.Y, moved Z axially by the cylinder 6 in the 15 deg. slant state to the mounting position on the board 1 thereby and stopped at the abutting position. In this case, the compressed spring 7 to adjust the abutting pressure is provided for avoiding the abutting face from breakage, etc.
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