| 摘要 |
PURPOSE:To obtain the titled composition having excellent moisture-resistance and heat-resistance and suitable as a resin for the sealing of semiconductor devices, electronic circuit parts, etc., by compounding an epoxy resin with specific amounts of a curing agent, a specific organometallic compound, a petroleum sulfonic acid metal salt and a dithiocarbamic acid metal salt. CONSTITUTION:The objective composition can be produced by compounding (A) an epoxy resin (e.g. glycidyl ether epoxy resin) with (B) a curing agent (e.g. a precondensate of a synthetic resin such as phenolic resin), (C) one or more organometallic compounds selected from organic aluminum compound, organic titanium compound, etc., (D) a petroleum sulfonic acid metal salt of formula I (M is Ca, Ba, etc.; R<1> is paraffinic side chain or an aromatic hydrocarbon residue containing naphthene ring in the molecule) and (E) a dithiocarbamic acid metal salt of formula II (R<2> and R<3> are 1-18C alkyl, etc.; M is Zn, etc.). The amounts of the components C, D and E are 0.01-5(wt)%, 0.1-10% and 0.1-10% based on the component A, respectively.
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