| 摘要 |
PURPOSE:To maintain a sufficient electric conductivity and improve the reliability of electric continuity by a method wherein a bonding/wiring part is composed of a gold plating layer and a predetermined electrode/wiring pattern, consisting of at least a metallic chrome layer and a metallic nickel layer, is formed. CONSTITUTION:After a resist 15 is removed and a resist solution is applied, a resist pattern 11, covering a predetermined electrode/ wiring part, is formed by exposure and development and etching is carried out by using the resist pattern 11 as a mask to form a metallic nickel pattern 10'. Electrolytic gold plating is carried out by using the conductive layer as a cathode. The suitable thickness of the gold plating film 13 is about 0.4-5.0mum. After a resist 14 is removed by remover or the like and a resist is applied to the whole surface, a resist pattern 17, covering the parts corresponding to an electrode/wiring part 2 and a photoelectric conversion part 16, is formed by exposure and development. In this condition, the exposed part of the metallic chrome film 9 is removed by etching and the resist pattern 17 is removed.
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