| 摘要 |
PURPOSE:To reduce the influence of the keeping condition and keeping period of a sample to be tested, to be inflicted on the result of a reliability test, by adding one process, in which the sample to be tested is left in high-temperature air before the sample is thrown in the reliability test. CONSTITUTION:In this testing method, samples to be tested are prepared or selected and kept until the preparation for throwing the samples in a reliability test is completed. Then the samples are left in a high-temperature atmosphere just before they are thrown in the test and, finally, the samples are used for the reliability test after the moisture absorbed by the enclosed resin of the sample while the samples are kept is removed. Since the moisture contained by the samples to be tested is removed before executing the reliability test in such way, abrupt expansion of the moisture is eliminated even when a sudden stress, such as heat resisting test, etc., is applied and data of reliability tests of manufactured semiconductor devices can be obtained with less influences of the keeping period after they are manufactured.
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