| 摘要 |
PURPOSE:To separate a wafer from a mask rapidly without fail doing no damage to the wafer by a method wherein a vacuum chuck for adsorbing the wafer is separated from the wafer in non-adsorbing state and then the mask is vacuumized downward to be bent upward so that a part or all part of wafer may be peeled off. CONSTITUTION:A wafer 1 and a mask 5 are vacuum-adsorbed and then the wafer 1 is pushed up by a chuck 3 to augment adhesion for exposure process. After finishing the exposure processing, the chuck 3 only is lowered with the vacuum state held as it is. The mask 5 starts bending upward due to the vacuum adsorption (F1) making gaps from the wafer 1. Resultantly, the wafer 1 adhered to the mask 5 can be peeled off from the peripheral parts. Finally the wafer 1 completely peeled off falls down on the chuck 3 to be reset to the original position by releasing the vacuum adsorption.
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