发明名称 GOLD PLATING BATH FOR TITANIUM AND TITANIUM ALLOY
摘要 PURPOSE:To improve the corrosion resistance and appearance of Ti or a Ti alloy by direct gold plating with satisfactory adhesion by using a gold plating bath contg. a fluorine compound at a specified concn. CONSTITUTION:This gold plating bath for Ti and Ti alloys contains 0.1-50g/l fluorine compound such as hydrofluoric acid. When the bath is used, an oxide film on the surface of Ti or a Ti alloy is removed during plating and gold plating having satisfactory adhesion, superior corrosion resistance and fine appearance is directly formed on the metal. The bath requires no special equipment and satisfactory plating can be carried out at a low cost.
申请公布号 JPS62247095(A) 申请公布日期 1987.10.28
申请号 JP19860091572 申请日期 1986.04.21
申请人 SEIKO INSTR & ELECTRONICS LTD 发明人 KAWANABE MASAHARU
分类号 C25D3/48 主分类号 C25D3/48
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