发明名称 RESIN COMPOSITION FOR SMC
摘要 PURPOSE:To obtain the title composition which can give a sheet molding compound (SMC) which has a high strength and can be easily handled, by mixing a thickener with a resin which can be thickened and a resin which cannot be thickened. CONSTITUTION:A resin composition for SMC is obtained by mixing a resin (A) which can be thickened with a thickener comprising an unsaturated polyester resin or a vinyl ester resin with an most 40wt% resin (B) which cannot be thickened with a thickener (e.g., urethane acrylate), about 2 phr of a thickner (C) selected from among metal (hydr)oxides such as MgO and Mg(OH)2 and isocyanates and, optionally, a filler, mold release, shrinkage-lowering agent, colorant and curing agent. This composition is applied to the surface of a PE or PP sheet and reinforcing fibers are applied by pressure to the sheet. This assemblage is molded into a sheet, rolled and aged at room temperature or an elevated temperature to obtain a fiber-reinforced SMC.
申请公布号 JPS62292817(A) 申请公布日期 1987.12.19
申请号 JP19860134858 申请日期 1986.06.12
申请人 TOA NENRYO KOGYO KK 发明人 TAKEZAWA MAKOTO;MURAKAMI SHINKICHI;ISHIDA YUJI;MIYAZAKI MAKOTO;INOUE HIROSHI
分类号 C08L67/06;C08F290/00;C08F299/02;C08L67/00 主分类号 C08L67/06
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