| 摘要 |
PURPOSE:To reduce the size of a printed circuit substrate and to enhance the density thereby to shorten bonding steps by forming a bump which can simultaneously bond a semiconductor element, such as an IC, an LSI, etc. on the substrate. CONSTITUTION:After a copper foil is bonded on a whole printed circuit substrate 10, it is etched to form a wiring pattern 11, and a diffusion preventing layer of Ni, Pt is provided thereon as required. Then, a part except the bump forming part of the pattern 11 is covered with an organic resist film 20, and a bump 12 made of Au or solder is formed by electrolytically plating to the edge of the film 20 while the pattern 11 is contacted with the bump forming part. Then, the film 20 is removed, and the bump 12 extended at the top remains on the pattern 11. Thus, the bump connection of a semiconductor element can be simultaneously processed to shorten a bonding time.
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