| 摘要 |
PURPOSE:To coat the optimum amt. of solder on a refining connection land by using the nozzle provided with the recessed part in the specified shape at the tip, injecting instantaneously a gas from the inner part by filling a solder paste in the recessed part and sticking the solder to a connection land. CONSTITUTION:In case of coating a solder paste 1 on the connection land 21 of a printed circuit board 2, the nozzle 3 having at the tip the recessed part 4 that a coating area and amt. are decided according to the shape and provided with the gas passage 31 passing to the tip from the inner side is prepared. A solder paste 1 is filled up to the recessed part 4 at the tip of this nozzle 3, which is moved onto a connection land 21, a gas is instantaneously injected from the inside of the nozzle 3 and the solder paste 1 of the recessed part 4 is sprayed and coated on the connection land 21. The optimum amt. of the solder paste 1 is thus coated correctly in the specified shape on the refined connection land 21. |
