| 摘要 |
PURPOSE:To prevent a shock from being applied to a semiconductor device at the cutting time by a method wherein after a semiconductor element is encapsulated on a lead frame with a resin, the joints between the resin package and the frames of the lead frame are repeatedly bent for cutting. CONSTITUTION:A semiconductor device 1 comprised of mounting and bonding a semiconductor element on a lead frame and thereafter encapsulating them with an epoxy resin is attached to the frames 3 of the lead frame by means of joints 2. Lead sections 7 are provided to the semiconductor device 1. The semiconductor device 1 is held by pressing the lead sections 7 between a stripper 4 and a die 5. Then, the lead frame's frames 3 are grasped by pressing plates 6, and by bending the joints 2 repeatedly to provide repeated positive and negative stresses in the arrow directions, the breaking or fatigue failure of the joints 2 is caused.
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