| 摘要 |
PURPOSE:To obtain the title composition which undergoes pseudo curing by heating for a short time to give a hardened material having excellent flexibility and releasability, by incorporating a specified powdery (meth)acrylate polymer into a thermosetting epoxy resin adhesive comprising a liquid epoxy resin and a heat-active curing agent. CONSTITUTION:100pts.wt. liquid epoxy resin (a) having at least one epoxy group in a molecule, comprising, e.g., a condensate of bisphenol A with epichlorohydrin is mixed with 1-15pts.wt. heat-active curing agent (b) for epoxy resin, such as dicyandiamide. This mixture is mixed, as required, with a cure accelerator such as p-chlorophenyldimethylurea, a filler, etc. to give a thermosetting epoxy resin adhesive (A). Component A is then mixed with 10-100pts.wt., based on 100pts.wt. component (a), dried powdery (meth-acrylate polymer (B) [e.g., a (meth)acrylate polymer containing at least 0.4wt% COOH group] having an average molecular weight of 300,000 or higher and a fundamental particle diameter of 100mu or smaller.
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