| 摘要 |
PURPOSE:To prevent the yield of a gap between first and second resin seal parts, in a double-molded type resin sealed semiconductor device, by forming protruding parts having approximately cross shapes on the opposite surface of heat dissipation fins in the first resin seal part. CONSTITUTION:A plurality of power transistors and the like are mounted on a bed part 1 of the conductive metal plate of a lead frame and wired to lead terminals. The rear surface of the bed part 1 is exposed. Protruding parts having approximately cross shapes (six approximate cross shapes are continued in the configuration in the Figure) are formed on the opposite surface of the bed part. Resin seal is performed in this way, and a first resin seal part 8 is formed. The rear surface of the bed part 1 and heat dissipation fins 9 made of metal plates are arranged in a metal mold with a slight gap between the two. Resin seal is performed, and a second resin seal part 10 is formed. Since both surfaces of the first seal part 8 are tightened by the second seal part 10, a gap is not yielded between both seal parts. Even if shocks and the like are imparted, heat dissipation characteristic is not deteriorated. |
